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应用范围:主要应用于IC生产和半导体元器件生产中晶片的湿法化学工艺
Application: These equipments are widely utilized in semiconductor clean process such as IC, material, components etc.
主要特点:一体化结构,布局紧凑美观合理,采用模块化设计,可根据客户工艺设计组合。
Feature: Integrated design, nice appearance. Modularizing is adopted in design for meeting the special demands from different clients
相关业绩:半导体清洗设备、台面腐蚀机、全自动腐蚀清洗、硅片清洗系列等
Project experiences:Semiconductor cleaning equipment, corrosion platform, automatic corrosion rinse platform, wafer rinse platform etc.
技术规格:非标定制。
Technical Specification: Non-standard specifications, it is customized.
配套选项:QDR(quick dump rinse)清洗槽、PH和电导率的在线检测与控制,各种工艺模块和伺服机械传送系统等
Option: QDR tanks, online detecting and controlling of PH and conductivity,difference process modules, wafer servo motor transportation etc.
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