摘要：本文分3部分刊出。第一部分回顾了国内钢铁件HEDP直接镀铜工艺的开发历程以及国内外HEDP无氰镀铜的工业应用状况。分析了HEDP、柠檬酸盐、焦磷酸盐和氰化物作为碱性镀铜配位剂的优缺点。结合近30年来的生产实践，认为HEDP还是目前碱性无氰镀铜的首选配位剂。 关键词：钢铁；镀铜；l-羟基乙叉一1，1一二膦酸；配位剂 中图分类号：TQl53．14 文献标志码：A 文章编号：1004-227X(2009)09-0007-04 Renew of HEDP direct copper plating process on iron and steel workpiece aRer 30 years of development-- Part L History and recent 30 years of improvement／／FANG Jing-Li Abstract：This paper is to be published in three parts．In the first part，the development history of HEDP direct copper plating process in China and its industrial applications at home and aboard were reviewed．The advantages and disadvantages of chelating agents HEDP，citrate，pyrophosphate and cyanide used for alkaline copper plating were analyzed，based on 30 years of production practice．It is considered that，for the time being，HEDP is the preferred chelating agent for alkaline copper plating in replace of cyanide． Keywords：iron and steel；copper plating；1-hydroxy- ethylidene-1，1-diphosphonic acid；chelating agent Author'S address：Fuzhou Nobel Surface Technology Ltd，Fuzhou Jinshan Incubator of Technology Enterprises，The Second floor，N0．3 Building，Fuzhou 350003，China
钢铁件HEDP直接镀铜工艺开发30年回顾：从焦磷酸盐镀铜的顽强生命力可见HEDP镀铜的光辉前景 钢铁件HEDP直接镀铜工艺开发30年回顾：国内HEDP直接镀铜的开发历程 钢铁件HEDP直接镀铜工艺开发30年回顾：国内外HEDP碱性镀铜的工业应用状况 |
