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应用范围：应用于片式元器件和微薄细小金属件的批量电镀；应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。
Application：The mass plating production of chip component and micro metal parts；Pretreatment, silver plating, nickel plating and tin plating of chip components.
相关业绩：SMD电镀全自动生产线、接插件电镀全自动生产线等
Project experiences：Electroplating production line for SMD and connectors etc.
主要特点：根据不同用户的生产需求对滚筒系统进行工艺最优化设计，系统稳定、生产效率高，镀层细致、光亮、均匀性好。采用人机界面触摸屏式控制管理，并可对数据，PH，时间，运行情况等进行有效监控，工艺参数调整方便快捷。
Feature: The roller is optimal designed of technology according customers requirements. Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc，and is easy to adjust process parameter according to different process feature.
技术规格：悬臂式行车；行车行走速率0-25m/min；行车提升速率0-12m/min；提升重量50-80kg。
Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-100 kg.
配套选项：专用滚筒、溶液在线检测及自动添加、调速滚筒、整流器自动控制、计算机控制系统。
Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.