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应用范围：应用于易粘结的片式元器件和微薄细小金属件的批量电镀。
Application: The mass production of chip component tended to bond together each other and micro metal parts.
相关业绩：SMD电镀全自动生产线、接插件电镀全自动生产线等。
Project experiences：Electroplating production line for SMC, connectors etc.
主要特点：振筛的敞开式结构使受溶液循环影响的屏蔽作用消除，因而允许使用的电流密度上限提高，沉积速度加快，溶液电流阻力小；不存在滚镀的翻滚情况，对零件的擦伤、磨损减轻；零件表面电流分布均匀，镀层厚度均匀；不存在滚镀的夹、卡零件等现象，成品率大大提高
Feature: The vibrating screen with open structure can avoid any shielding effects caused by the solution circulation. So the higher upper limit of electric current density is used, deposition rate is speeded up, and the resistance of plating solution is small; vibration plating is not rolling like barrel plating, for this reason it reduces the gall of work pieces by rolling; vibration plating make current on parts surface evenly distribute, and improves thickness uniformity of electrodeposits; it will not catch or stick parts sometimes like barrel plating, the qualified ratio of product was improved obviously.
技术规格：所装工件0.25 kg -25kg；振筛直径Ф150mm、Ф200mm、Ф250mm, Ф300mm、Ф500mm
Technical Specification: Capacity 0.5-10 Kg; vibrating screen diameter: Ф150mm-Ф500mm
配套选项：振筛频率调整、整流器自动控制、计算机控制系统。
Option: Shaking frequency adjustment, rectifier automatic control system, computer control system.