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应用范围：应用于集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Application scope：Gold, silver and nickel plating of IC lead
主要特点：机电一体化结构，操作方便、设备可靠性高，采用逆流漂洗、微排放技术，节能环保。
Feature: Mechanical and Electrical Integration structure, easy operation, high reliability, use countercurrent rinsing and micro drain techniques, energy saving, friendly environment.
技术规格：非标定制。
Technical Specification: Non-standard specifications, it is customized.
配套选项：计算机监控、槽液成分测定及自动充装置、阴极移动装置。
Options: Computer monitoring system, bath solution testing and automatic feed device, cathode shifter.