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应用范围：主要应用于IC生产和半导体元器件生产中晶片的湿法化学工艺
Application: These equipments are widely utilized in semiconductor clean process such as IC, material, components etc.
主要特点：一体化结构，布局紧凑美观合理，采用模块化设计，可根据客户工艺设计组合。
Feature: Integrated design, nice appearance. Modularizing is adopted in design for meeting the special demands from different clients
相关业绩：半导体清洗设备、台面腐蚀机、全自动腐蚀清洗、硅片清洗系列等
Project experiences：Semiconductor cleaning equipment, corrosion platform, automatic corrosion rinse platform, wafer rinse platform etc.
技术规格：非标定制。
Technical Specification: Non-standard specifications, it is customized.
配套选项：QDR(quick dump rinse)清洗槽、PH和电导率的在线检测与控制，各种工艺模块和伺服机械传送系统等
Option: QDR tanks, online detecting and controlling of PH and conductivity，difference process modules, wafer servo motor transportation etc.