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应用范围：应用于电子元器件批量电镀；应用于电子元器件的前处理、镀银、镀金、镀镍、镀锡工艺。
Application：The mass production of chip component and micro metal parts；Pretreatment, silver plating, nickel, gold plating and tin plating of electronic components.
相关业绩：PCB化学镀铜自动线、DBC化学镀镍自动线、微波铝件阳极氧化自动线、铝件镀银自动线、镀金振挂两用自动线、陶瓷金属化镀镍金自动线等
Project experiences：Electroplating automatic production line for PCB electroless copper plating , DCB electroless nickel plating, microwave aluminum oxide, aluminum coated silver, ceramic metallization plating nickel gold etc.
主要特点：系统稳定、生产效率高，镀层细致、光亮、均匀性好。采用人机界面触摸屏式控制管理，并可对数据，PH，时间，运行情况等进行有效监控，工艺参数调整方便快捷。
Feature: Reliable system, high product efficiency, bright, fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc，and is easy to adjust process parameter quickly according to different process feature.
技术规格：悬臂式行车；行车行走速率0-25m/min；行车提升速率0-12m/min；提升重量50-80kg。
Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-80 Kg.
配套选项：专用滚筒、溶液在线检测及自动添加、调速滚筒、整流器自动控制、计算机控制系统。
Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control system etc.