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美国Extec品牌12205型高密度钻石切割碟
推荐用途：金属基复合材料、钛、热喷涂涂料、印刷电路板、骨头。
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones。
有以下型号可供选择：
12200 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12205 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12210 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12215 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12220 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12218 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
美国Extec品牌12205型高密度钻石切割碟