日期:2012-04-17 09:59
es for continuous high-speed spot silver plating process were summarized．
Keywords：electronic product；silver plating；continuous plating；spot plating
First-author’S address：Department of Scientific Research，Shandong University of Science and Technology， Qingdao 266510，China
1 前言
在电子元器件行业采用全自动大规模生产技术、市场竞争日益激烈的今天，人们对为之服务的电子电镀行业也提出了更高的要求，如每批产品的镀层厚度、均匀度、硬度、亮度都须一致，电镀区域严格控制，成本降低。但普通电镀设备