日期:2012-04-16 10:27
2003:2~5.[2]杨宏强,全球PCB产业发展近况[J].印制电路信息,2008(12):9~16.[3]Chen Y H,Wang Y Y,Wan C C.Microstructural charac-teristics of immersion tin oatings on copper circuitries in circuit boards [J]. Surface and Coatings Technology,2007,202:417~424.[4]Wang H Y,Mark P.Effect of low concentrations of Pb2+on Sn electrodeposition in methyl sulphonic acid solutions [J].Electrochemical Acta,2008,53:2430~2440.[5]管凌飞,范成威,接插件电镀锡铅故障处理[J].电镀与环保,2006,26(5):297~302.[6