日期:2012-04-16 10:27
6]Martyak N M, Seefeldt R.Additive-effects during plating inacid tinmethanesulfonateelectrolytes[J].Electrochimica Acta,2004,49:4303~4311.[7]John P C, Irshad A.Molecular plating of actinides on thinbackings[Jl. Nuclear Instruments and Methods in PhysicsResearch A,2008,590:131~133.[8]Huttunen S E, Tlainen T.Autocatalytic tin plating in thefabrication of tincoated copper tube[J].Joumal of Materials Processing Technology,2005,170:211~219.[9]李俊华,费锡明,徐芳.2种有机添加剂对锡电沉积的影响[J].