甲醛和OP乳化剂对印刷电路板酸性半光亮镀锡的影响
日期:2012-04-16 10:27
应用化学,2006,23 (9):1043~1046.[10]Kim K S,Han W 0, Han S W. Whisker growth on surfacetreatment in the pure tin plating[J]. Joumal of ElectronicMaterials,2005,34( 12):1579~1585.[11]Whitlaw K J,Egli A, Toben M. Preventing whiskers in electrodeposited tin for semiconductor lead frame applications[J].Circuit World,2004,30(2):20~24.[12]Garcia G M, Perez H V, Garcia J A,et al.Electrochemicalrecovery of tin from the activating solutions of the electrolessplating of polymers galvanostatic operatio
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