日期:2012-04-14 16:13
镍金层可焊性的影响因素[J].印制电路信息,2006(4):4043.[15]HUTTUNEN-SAARIVIRTA E,TIAINEN T.Autoeatalytic tin plating inthe fabrication of tin-coated copper tube[J].J Mater Process Technol,2005,170(1/2):21 l-219.[16]卫桂芳.化学沉镍金漏镀渗金的原因和措施叨.印制电路信息,2004(5):35.37.[17]钟华.多层印制线路板沉金工艺控制浅析[EB/OL].[2003-12-23]http://www.diamt.net.cn/xjz巧s/giis/process/El/ei7.pdf.[18]ZENG K J,STIERMAN R,ABBOTT D,et al.The root cause of blackpad fai