日期:2012-04-18 09:31
头。关键词：铜一钨复合电沉积；电接触材料；显微硬度；接触电阻中图分类号：TB331；TQl53．14文献标志码：A文章编号：1004―227X(2009)05―0017―03Study on eIectrodepositiOn process and properties of copper-tungsten composite coating／／LI Guang―yu，ZHANG Xiao―yan*，YAN Chao-jie，ZHU Li-bing，CHEN Xiang-xiangAbstract：A copper-tungsten composite coating was electrodeposited on red copper substrate by adding tungsten particles(1-3μmin diameter)to a copper plating bath．The effects of tungsten mass con