e general operation of an acid copper-plating bath. An anode to cathode distance of 20 to 30 cm (8 to 12 inches) is recommended to insure a more uniform distribution of the deposit.
It should be noted that anode and cathode placement, agitation, copper concentration, temperature, electrical connection and circuit configurations could affect distribution and usable current density range. More details of these effects can be found in the attached troubleshooting guide.
The optimum temperature fo